Title:
支持体の製造方法
Document Type and Number:
Japanese Patent JP4199320
Kind Code:
B2
Abstract:
A method for forming supports for use in electronic components. A plate of copper-based alloy including from 0.1 to 1.0% by weight nickel, and from 0.005 to 0.1% by weight of phosphorus is melted and cast. The alloy includes fine precipitates of nickel phosphides throughout the copper matrix. The plate is subjected to a series of deformation operations including, rolling and intermediate annealing at a temperature in the range of 400 DEG to 600 DEG C., with the annealing temperature being maintained for two to four hours, thereby maximizing the production of fine precipitates of nickel phosphides within the alloy. After alloy formation, the plate is coated with a layer of nickel, cut into a desired shape, and secured to an electronic component.
More Like This:
Inventors:
Jero Durani-text
Application Number:
JP20459497A
Publication Date:
December 17, 2008
Filing Date:
July 30, 1997
Export Citation:
Assignee:
Grisette Society Anonym
International Classes:
C22C9/06; C22F1/08; H01L23/495; H01L23/50
Domestic Patent References:
| JP58104148A | ||||
| JP60002638A | ||||
| JP57093555A |
Attorney, Agent or Firm:
Kenho Ikeda