Title:
弾性表面波装置、高周波モジュール及び弾性表面波装置の製造方法
Document Type and Number:
Japanese Patent JP6493524
Kind Code:
B2
Abstract:
A surface acoustic wave device includes a piezoelectric substrate, an IDT electrode, a support layer, a cover layer, and a pillar-shaped electrode. The IDT electrode is provided on a main surface of the piezoelectric substrate. The support layer is disposed around a region where the IDT electrode is provided and has a larger height from the main surfaces than a height of the IDT electrode therefrom. The cover layer is disposed on the support layer and covers the IDT electrode. The pillar-shaped electrode is located on one of the main surfaces where the pillar-shaped electrode is in contact with the support layer. The pillar-shaped electrode is electrically connected to the IDT electrode. The pillar-shaped electrode includes a top surface and a side surface. Each of the top surface and the side surface includes a portion exposed to outside.
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Inventors:
Kentaro Funabashi
Application Number:
JP2017519090A
Publication Date:
April 03, 2019
Filing Date:
April 21, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H03H9/25; H03H3/08
Domestic Patent References:
| JP2000261284A | ||||
| JP2014110370A | ||||
| JP2015012428A |
Foreign References:
| WO2006106831A1 |
Attorney, Agent or Firm:
Shuichi Yoshikawa
Masao Sakajima
Masao Sakajima