Title:
温度補償型発振器の製造方法
Document Type and Number:
Japanese Patent JP3973910
Kind Code:
B2
Abstract:
A method of manufacturing a temperature compensated oscillator comprises the steps of: assembling an oscillator in which an IC chip (16) constituting a temperature compensation circuit (30,30') with an oscillation circuit (20) and a compensation data storage circuit (31), and a resonator (15) for said oscillation circuit (20) are mounted in a package (10); adjusting said resonator (15) with an oscillation frequency of said oscillation circuit (20) to a desired oscillation frequency in condition that said oscillator is kept at a reference temperature, in condition that a temperature compensation function of said temperature compensation circuit (30,30') is disabled; sealing said resonator (15) hermetically; creating a temperature compensation data and storing it into said compensation data storage circuit (31); and enabling said temperature compensation function of said temperature compensation circuit (20).
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Inventors:
Yasuhiro Sakurai
Application Number:
JP2002011998A
Publication Date:
September 12, 2007
Filing Date:
January 21, 2002
Export Citation:
Assignee:
Citizen Holdings Co., Ltd.
International Classes:
H03B5/32; H03B5/04; H03L1/02; H03L7/18; H03L7/183
Domestic Patent References:
| JP2146805A | ||||
| JP61032604A | ||||
| JP58173488A | ||||
| JP56097896A | ||||
| JP4335704A | ||||
| JP3280605A | ||||
| JP8186442A | ||||
| JP54089255U | ||||
| JP1317004A | ||||
| JP2001057509A | ||||
| JP63312704A | ||||
| JP8008740A | ||||
| JP58165080A | ||||
| JP54085771A |
Attorney, Agent or Firm:
Kei Osawa