Title:
熱型赤外線センサーの製造方法
Document Type and Number:
Japanese Patent JP5884568
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce reflectance of infrared on a rear face of an infrared absorption film in a thermal infrared sensor that receives infrared from the rear face side of the infrared absorption film.SOLUTION: The thermal infrared sensor comprises: an infrared absorption film 9 separated from a semiconductor substrate 5 by a cavity part 7; and a temperature sensor 11 detecting a temperature change in the infrared absorption film 9. The infrared absorption film 9 has an infrared antireflection structure including a sub-wavelength structure 9a on a surface of a semiconductor substrate 5 side. The cavity part 7 is formed by forming a through hole in the semiconductor substrate 5.
Inventors:
Hideyoshi Noguchi
Application Number:
JP2012055142A
Publication Date:
March 15, 2016
Filing Date:
March 12, 2012
Export Citation:
Assignee:
株式会社リコー
International Classes:
G01J1/02; H01L35/00; H01L35/34; H01L37/00
Domestic Patent References:
| JP2006047085A | ||||
| JP2010107374A | ||||
| JP2006226891A | ||||
| JP9257564A | ||||
| JP9061234A |
Foreign References:
| WO2011030428A1 | ||||
| US6531699 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito