Title:
熱型赤外線固体撮像装置の製造方法
Document Type and Number:
Japanese Patent JP4865957
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal infrared solid-state image sensor with a high infrared detection sensitivity and a short thermal time constant. SOLUTION: In this thermal infrared solid-state image sensor provided with a detection part and a signal processing part for processing a signal transmitted from the detection part, which are provided on the same silicon substrate, the thickness of the insulating film of the detection part is set smaller than that of the interlayer separation layer of the signal processing part.
Inventors:
Yasuaki Ota
Yasuhiro Kosasayama
Takanori Sone
Yasuhiro Kosasayama
Takanori Sone
Application Number:
JP2001147906A
Publication Date:
February 01, 2012
Filing Date:
May 17, 2001
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G01J1/02; G01J1/42; G01J5/48; H01L27/14; H01L35/00; H01L37/02; H04N5/33; H04N5/335; H04N5/369
Domestic Patent References:
| JP11051762A | ||||
| JP7273306A | ||||
| JP10209418A | ||||
| JP2000321125A | ||||
| JP2001041818A | ||||
| JP2000088640A | ||||
| JP2000019010A | ||||
| JP2000227374A | ||||
| JP8285680A |
Attorney, Agent or Firm:
Aoyama Aoi
Takuji Yamada
Haruo Nakano
Takuji Yamada
Haruo Nakano