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Title:
熱電半導体の製造方法、熱電変換素子の製造方法及び熱電変換装置の製造方法
Document Type and Number:
Japanese Patent JP4284589
Kind Code:
B2
Abstract:

To provide a method of manufacturing a thermoelectric semiconductor used for manufacturing a highly efficient thermoelectric converter or a thermoelectric conversion device which is capable of restraining elements from becoming irregular in thermoelectric conversion properties, and to provide a method of manufacturing the thermoelectric converter and the thermoelectric conversion device.

At least, n-type thermoelectric semiconductor element material is compacted into an n-type thermoelectric semiconductor element material 1A. A low oriented region 1b located inside the compact surfaces is removed from the thermoelectric semiconductor element material 1A as thick as prescribed along the compact surface. The modified thermoelectric semiconductor element material 1A is bonded to a p-type thermoelectric semiconductor element material 12A which is manufactured in the same method as above to obtain a joined body, and the joined body is divided into paired elements 5. The large number of the paired elements 5 are tabularly bonded together. Electrodes 7 and 8 and supports 19 and 24 are fixed on the board composed of the paired elements 5 to form a thermoelectric converter 11, such as a Peltier element or the like.

COPYRIGHT: (C)2004,JPO&NCIPI


Inventors:
Masaki Orihashi
Motohisa Haga
Seiichi Miyai
Kimura Keiichi
Yasutoshi Noda
Hiroyuki Kitagawa
Yoshinori Morisaki
Application Number:
JP2003007900A
Publication Date:
June 24, 2009
Filing Date:
January 16, 2003
Export Citation:
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Assignee:
ソニー株式会社
International Classes:
H01L35/34; H01L35/14; H01L35/16; H01L35/20; H01L35/22; H01L35/24; H01L35/32; H02N11/00
Domestic Patent References:
JP2000138399A
Attorney, Agent or Firm:
Hiroshi Osaka