Title:
薄型温度ヒュ-ズ及び薄型温度ヒュ-ズの製造方法
Document Type and Number:
Japanese Patent JP4396787
Kind Code:
B2
Abstract:
A thin type thermal fuse is structured by a resin base film (11), a pair of belt-shaped lead conductors (2), a low melting-point fusible alloy piece (3), flux (4) and a resin cover film (12). Tip portions of the pair of belt-shaped lead conductors is fixed on the resin base film. The low melting-point fusible alloy piece (3) is coupled between the tip end portions of the belt-shaped lead conductors (2). The flux (4) applied on the low melting-point fusible alloy piece (3). The resin cover film (12) which is disposed on a one surface of the resin base film (11) so that a space between said films at peripheries of both the resin cover film and the resin base film is sealed and a space between the resin cover film and the belt-shaped lead conductors is sealed. In the thin type thermal fuse, a relation of (V/L)<1/2 >/d
Inventors:
Kawanishi Toshiro
Application Number:
JP17967598A
Publication Date:
January 13, 2010
Filing Date:
June 11, 1998
Export Citation:
Assignee:
Uchihashi STEC Co., Ltd.
International Classes:
H01H37/76; H01H85/00; H01H37/00; H01H69/02
Domestic Patent References:
| JP7201265A | ||||
| JP1012111A | ||||
| JP343925A |
Attorney, Agent or Firm:
Mikatsu Matsutsuki