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Title:
MANUFACTURING METHOD OF TRANSPARENT CONDUCTIVE SUBSTRATE, AND TRANSPARENT CONDUCTIVE SUBSTRATE
Document Type and Number:
Japanese Patent JP2008218243
Kind Code:
A
Abstract:

To provide a manufacturing method of a transparent conductive substrate which has a uniform transparency and in which an arc discharge from conductive particulates by microwave irradiation is suppressed.

A step in which an ink containing conductive particulates is coated on a transparent base material to form a treatment membrane containing conductive particulates, and a step in which a microwave of a single mode is irradiated on the treatment membrane to form the transparent conductive membrane on the base material are equipped. According to this forming method of the transparent conductive substrate, while suppressing temperature elevation of the base material by microwave irradiation, selective heating of only the treated membrane containing conductive particulates becomes possible. Accordingly, formation of a transparent conductive membrane having a high conductivity on a base material having a low heat resistance becomes possible. Furthermore, by irradiating microwaves uniformly on the treatment membrane containing conductive particulates, the arc discharge from the conductive particulates can be suppressed, and even formation of such a transparent conductive membrane, for example, which has a uniform transparency and in which transmittance of the light with wavelength of 550 nm is 88% or more also becomes possible.


Inventors:
Hojo, Mikiko
Take, Seiji
Application Number:
JP2007000054906
Publication Date:
September 18, 2008
Filing Date:
March 05, 2007
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01B13/00; B05D3/06; B05D5/12; H01B5/14; H01B13/00; B05D3/06; B05D5/12; H01B5/14