Title:
MANUFACTURING METHOD OF WAFER
Document Type and Number:
Japanese Patent JP2016150432
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wafer capable of stably holding the wafer by a chuck table such as a grinding device of the next process.SOLUTION: A manufacturing method of a wafer uses a multi-wire electric discharge machining device having a plurality of guide rollers, a wire wound in a plurality of times on the guide rollers, a base part for fixing an ingot, cut-in feed means for moving the base part in the X-axis direction, indexing feed means for moving the base part in the Y-axis direction and a high frequency pulse power source unit for supplying high frequency pulse electric power. The manufacturing method of a wafer comprises a division step (ST1) of dividing the ingot fixed to the base part into a plurality of wafers, a proximity step (ST2) of moving the base part in the Y-axis direction and a finishing step (ST3) of moving the base part in the opposite direction to that of the division step (ST1). In the finishing step (ST3), discharge voltage is low or discharge time is short.SELECTED DRAWING: Figure 3
Inventors:
TAWA YASUNOBU
MORI TAKASHI
MORI TAKASHI
Application Number:
JP2015031008A
Publication Date:
August 22, 2016
Filing Date:
February 19, 2015
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23H7/02; B23H7/06; B23H7/10; B23H9/00
Domestic Patent References:
| JP2012061550A | 2012-03-29 | |||
| JP2013153691A | 2013-08-15 |
Attorney, Agent or Firm:
Hiroaki Sakai