Title:
キャリア基材付き配線基板、キャリア基材付き配線基板の製造方法
Document Type and Number:
Japanese Patent JP6637864
Kind Code:
B2
Abstract:
A carrier base material-added wiring substrate includes a wiring substrate and a carrier base material. The wiring substrate includes an insulation layer, a wiring layer arranged on a lower surface of the insulation layer, and a solder resist layer that covers the lower surface of the insulation layer and includes an opening that exposes a portion of the wiring layer as an external connection terminal. The carrier base material is adhered by an adhesive layer to the solder resist layer. The carrier base material includes an opening that is in communication with the opening of the solder resist layer and exposes the external connection terminal. The opening of the carrier base material has a diameter that is smaller than that of the opening of the solder resist layer.
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Inventors:
Atsushi Sato
Kondo Human Resources
Fukase Katsuya
Kondo Human Resources
Fukase Katsuya
Application Number:
JP2016191485A
Publication Date:
January 29, 2020
Filing Date:
September 29, 2016
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H01L23/12; H05K3/00
Domestic Patent References:
| JP2009260335A | ||||
| JP2009239224A | ||||
| JP2004235612A |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda