木質セメント板の製造方法

Title:

木質セメント板の製造方法

Document Type and Number:

Japanese Patent JP5166750

Kind Code:

B2

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Inventors:

Yuji Yamazaki
Shinya Higuchi
Kazuhisa Yoshida

Application Number:

JP2007074318A

Publication Date:

March 21, 2013

Filing Date:

March 22, 2007

Export Citation:

Assignee:

Nichiha Corporation

International Classes:

B28B3/02

Domestic Patent References:

Previous Patent: JPS5166749

Next Patent: SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF