Title:
木質複合板の製造方法
Document Type and Number:
Japanese Patent JP6985657
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a woody composite board.SOLUTION: The invention relates to a manufacturing method of a woody composite board including: an adhesion layer forming process for forming an adhesion layer by adding an adhesive to at least one surface of a base material; an arrangement process for arranging, in the adhesion layer, a woody small pieces, etc. to which the adhesive is added; and a heat-press forming process for acquiring a woody composite board in which a surface base material comprising the woody small pieces, etc. and the base material are adhered by thermally pressing the base material on which the woody small pieces, etc. are arranged. The manufacturing method is characterized in at least one of: (i) the adhesion layer forming process is a process for forming the adhesion layer by spray-adding a mixture of an isocyanate-based adhesive and water to at least one surface of the base material; (ii) the thermal pressing of the heat-press forming process is performed at a thermal platen temperature of a range of greater than 180°C to 230°C or at the maximum surface pressure of a range of 3.0 MPa to 5.5 MPa; and (iii) when the woody composite board to which the surface base material is adhered to one surface of the base material, the thermal pressing of the heat-press forming process is performed with a thermal platen temperature of an arrangement surface side of the woody small pieces, etc. having a lower temperature than a thermal platen temperature of an opposite surface.SELECTED DRAWING: None
Inventors:
Nobu Fukino
Naoyuki Furuta
Naohisa Ogawa
Yukihiro Kato
Naoyuki Furuta
Naohisa Ogawa
Yukihiro Kato
Application Number:
JP2017047749A
Publication Date:
December 22, 2021
Filing Date:
March 13, 2017
Export Citation:
Assignee:
Hokkaido Research Institute
International Classes:
B27D5/00; B27N3/00; B32B7/12; B32B21/02; B32B37/12; C09J175/02
Domestic Patent References:
JP4052102A | ||||
JP2006263977A | ||||
JP6155422A | ||||
JP5237809A | ||||
JP2003311720A | ||||
JP7054467A | ||||
JP63276501A | ||||
JP8132405A | ||||
JP2001293704A |
Foreign References:
US20100178822 |
Attorney, Agent or Firm:
Patent Assistance Corporation ip Assist Patent Office
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