Title:
木質積層体の製造方法
Document Type and Number:
Japanese Patent JP6681622
Kind Code:
B2
Abstract:
Provided is a method for producing a wood laminate with which it is possible to inexpensively produce large wood laminates. First, a first wood material (10a) having an adhesive composition (2) coated on at least one surface thereof is prepared, and a second wood material (10b) bonded to the first wood material (10a) is prepared. An irradiation spot is then moved relative to the long direction of the first wood material (10a) while (1) or a plurality of laser lights (L) are irradiated on the adhesive composition (2), whereby the adhesive composition (2) is sequentially melted. The portion (21) of the first wood material (10a) on which the adhesive composition (2) is melted is then sequentially pressed tightly against the second wood material (10b), whereby the first wood material (10a) is bonded to the second wood material (10b). Repeatedly performing the above operation makes it possible to produce a wood laminate (1) formed by bonding a plurality of wood materials (10).
Inventors:
Toshiharu Yasue
Tadashi Wada
Tadashi Wada
Application Number:
JP2016517007A
Publication Date:
April 15, 2020
Filing Date:
March 18, 2016
Export Citation:
Assignee:
Mirai Wood Machinery Co., Ltd.
International Classes:
B27D1/04; B27M3/00; B32B21/13; B32B37/12
Domestic Patent References:
| JP62100574A | ||||
| JP62278001A | ||||
| JP5979711A |
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office