Title:
半導体基板、半導体チップ、及び半導体デバイスの製造方法
Document Type and Number:
Japanese Patent JP4509573
Kind Code:
B2
Inventors:
Fukuyo Bunji
Kenji Fukumitsu
Naomi Uchiyama
Kenji Fukumitsu
Naomi Uchiyama
Application Number:
JP2003574373A
Publication Date:
July 21, 2010
Filing Date:
March 11, 2003
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
B23K26/40; B23K26/364; B23K26/38; B28D5/00; H01L21/301; B23K101/40
Domestic Patent References:
| JPH04111800A | 1992-04-13 | |||
| JPH10305420A | 1998-11-17 | |||
| JPH06198475A | 1994-07-19 | |||
| JPH03281073A | 1991-12-11 | |||
| JPH11207479A | 1999-08-03 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Satoru Ishida
Shiro Terasaki
Satoru Ishida