Title:
MANUFACTURING FOR MULTI-LAYER CERAMIC ELECTRONIC PART
Document Type and Number:
Japanese Patent JP07099130
Kind Code:
A
Abstract:
PURPOSE: To achieve a miniaturization by a method wherein, in the multi-layer ceramic electronic part for use in various electric devices, a ceramic crude sheet is made a multi-layer by using a method of forming a via hole high in interlayer connectivity of the ceramic crude sheet and a manufacturing yield, in order to provide a multi-layer ceramic electronic part capable of obtaining a high manufacturing yield.
CONSTITUTION: A multi-via hole 8 is formed in a ceramic crude sheet 1 with high producibility by sandblasting, and stopgap 10 is accurately made so that a round can be formed at both ends of the via hole 8, and a multi-layer ceramic electronic part can be made.
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Inventors:
Nakao, Keiichi
Mori, Noboru
Mori, Noboru
Application Number:
JP1993000242426
Publication Date:
April 11, 1995
Filing Date:
September 29, 1993
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01G4/12; H01F17/00; H01F17/03; H01F41/04; H05K1/09; H05K3/00; H05K3/40; H01G4/12; H01F17/00; H01F17/02; H01F41/04; H05K1/09; H05K3/00; H05K3/40; (IPC1-7): H01F41/04; H01F17/00; H01F17/03; H01G4/12