Title:
MANUFACTURING OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP04256510
Kind Code:
A
Abstract:
PURPOSE: To enhance hole position accuracy at the machining time of a drill hole by means of an NC boring machine, and, at the same time, enhance quality of a printed wiring board and productivity by increasing stacking number of copper-clad laminated boards.
CONSTITUTION: Copper-clad laminated bodies 2, 3 or plural copper-clad laminated bodies 2, 3 having, at least, conductive patterns in their internal layers are stacked up, and a backplate 11 whereon a groove in the form of grid or an uniform unevenness is proved is stacked up on the copper-clad laminated bodies 2, 3 on the side of a drill at the time of drilling, and performs drilling in this state.
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Inventors:
Tanaka, Nobukata
Application Number:
JP1991000015173
Publication Date:
September 11, 1992
Filing Date:
February 06, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23B49/00; H05K3/46; B23B49/00; H05K3/46; (IPC1-7): B23B49/00; H05K3/46
