Title:
製造支援システムおよび製造支援方法
Document Type and Number:
Japanese Patent JP7291666
Kind Code:
B2
Abstract:
A manufacturing assist system for assisting manufacturing using a semiconductor manufacturing device, comprising: a holding unit that is disposed in an evaluation body and holds information specifying a semiconductor manufacturing device used or to be used in a use body and information specifying a manufacturing process to be executed by the semiconductor manufacturing device; an evaluation unit that is disposed in the evaluation body and evaluates the appropriateness of a material provided from a material supply body for supplying a material used by a semiconductor manufacturing device, on the basis of information specifying the material and information held by the holding unit; and an evaluation result providing unit for providing an evaluation result by the evaluation unit to the material supply body.
Inventors:
Rinka Higashiyama
Noboru Hayasaka
Noboru Hayasaka
Application Number:
JP2020085969A
Publication Date:
June 15, 2023
Filing Date:
May 15, 2020
Export Citation:
Assignee:
towa corporation
International Classes:
H01L21/02; G05B19/418; G06Q50/04; G16Y10/25; G16Y20/20; G16Y40/20
Domestic Patent References:
| JP2001356148A | ||||
| JP2002189896A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office