Title:
MARK ALIGNER
Document Type and Number:
Japanese Patent JPS5996730
Kind Code:
A
Abstract:
PURPOSE:To enable to perform a pattern positioning on a mask, a wafer and the like in an accurate and highly precise manner even when there is deviation in wafer measurements by a method wherein the mask is properly curved by adjusting the pressure inside the chamber member which is tightly contacted to the mask and the like, and the mask is corresponded to the expansion and to the contraction of the wafer by changing the projection measurements of the mask pattern. CONSTITUTION:The position of a wafer 3, namely the reference position of the wafer 3, is determined at the reference position of a mask 4 by operating an X-Y table 2. Then the positioning of the mask 4 and the wafer 3 is inspected at two points using a pair of alignment optical systems 18 and 19, and the amount of deviation thereof is detected. Ordinarily, the wafer is in a contracted state for the mask, a control valve 16 is controlled by a control section 17 based on the amount of deviation above-mentioned, and the interior of the chamber member 12 is formed into the prescribed vacuum pressure state. As a result, the mask 4 is warped inward of the member 12 as shown by a dotted line in the diagram due to differential pressure with the atmospheric air, and the projection measurements in plane direction of the mask pattern is substantially reduced, thereby enabling to perform an exposure with the pattern measurements corresponding to the contraction of the wafer 3.
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Inventors:
NAKAZAWA TOMIO
SATOU FUMIYOSHI
KADOTA KAZUYA
SATOU FUMIYOSHI
KADOTA KAZUYA
Application Number:
JP20616482A
Publication Date:
June 04, 1984
Filing Date:
November 26, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/30; G03F7/20; G03F9/00; H01L21/027; (IPC1-7): G03F7/20
Domestic Patent References:
| JPS55126246A | 1980-09-29 | |||
| JPS5612014A | 1981-02-05 | |||
| JPS5653846A | 1981-05-13 | |||
| JPS5778042A | 1982-05-15 |
Attorney, Agent or Firm:
Akita Haruki