MARK POSITION MEASURING DEVICE AND METHOD, EXPOSURE APPARATUS, AND MANUFACTURING METHOD OF MICRO DEVICE

Title:

MARK POSITION MEASURING DEVICE AND METHOD, EXPOSURE APPARATUS, AND MANUFACTURING METHOD OF MICRO DEVICE

Document Type and Number:

Japanese Patent JP2007324159

Kind Code:

A

Abstract:

To speed up the measurement of an alignment mark and simultaneously to measure a mark position precisely.

A mark position measuring device comprises: a wafer stage WS that places a wafer W and moves; alignment sensors AS1-3 for detecting alignment marks AM1-9 formed on the wafer W placed on the wafer stage WS; a plurality of stage marks SM1R-SM9R, SM1L-SM9L provided in an array on the wafer stage WS along the traveling direction of the wafer stage WS, namely Y direction, when detecting the alignment marks AM1-9 with the alignment sensors AS1-3; stage mark sensors SS1-2 for detecting the stage marks SM1R-SM9R, SM1L-SM9L when the alignment sensors AS1-3 are detecting the wafer marks AM1-9; and a control unit FIAU for obtaining the positions of the alignment marks AM1-9, based on the detection results of the sensors AS1-3, SS1-2.

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Inventors:

NAKAJIMA SHINICHI

Application Number:

JP2006149236A

Publication Date:

December 13, 2007

Filing Date:

May 30, 2006

Export Citation:

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Assignee:

NIKON CORP

International Classes:

H01L21/027; G01B11/00; G03F7/20

Attorney, Agent or Firm:

Yoshihiro Fujimoto

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