Title:
MARKING APPARATUS
Document Type and Number:
Japanese Patent JPH01189908
Kind Code:
A
Abstract:
PURPOSE:To facilitate clearing up causes of faults or defects in analysis thereof, by marking the rear face of a wafer with characteristic data for each chip. CONSTITUTION:A wafer 3 is transported automatically or manually to a wafer fixing chuck 1. A wafer fixing chuck driving motor 2 is actuated to fix the wafer 3 under an optimum pressure. A stage 6 on which the wafer 3 is fixed is moved at a pitch corresponding to one chip. Upon finishing the operation of the stage 6, a marker 4 marks the rear face of the wafer with data such as a lot number, water number, etc. Thus, data for each chip can be obtained by reading the rear face of the semiconductor chip.
Inventors:
SUZUKI MASAKI
Application Number:
JP1513488A
Publication Date:
July 31, 1989
Filing Date:
January 26, 1988
Export Citation:
Assignee:
SEIKO INSTR & ELECTRONICS
International Classes:
H01L21/02; (IPC1-7): H01L21/02
Domestic Patent References:
| JPS54877A | 1979-01-06 |
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