PURPOSE: To facilitate an adjustment of the angle of a marker, to make it possible to put a marking on arbitrary positions and to make it possible to inhibit the failure of marking in a semiconductor inspecting process to the minimum by a method wherein the marker is constituted into a structure, wherein the angle of the marker at a time when a marking is put on semiconductor defective chips can be arbitrarily set.
CONSTITUTION: A marking device is provided with angle adjusting functions at the time of marking. That is, a variable marking angle block 14, a fixed marking angle arm 15 and a fixed marking angle auxiliary arm 16 are provided. The angle of the marking device is arbitrarily changed by these arms 15 and 16 and a marking position on defective chips can be decided arbitrarily. Thereby, adhesion of ink to a probing needle to measure element characteristics according to the sizes of semiconductor chips is prevented and it becomes possible to put a marking on the defective chips.
SODA MASAJI
HIROSE TAKESHI
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