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Title:
MASK INSPECTION FOR SEMICONDUCTOR SPECIMEN FABRICATION
Document Type and Number:
Japanese Patent JP2023041623
Kind Code:
A
Abstract:
To provide a system and a method of mask inspection.SOLUTION: There are provided a system and a method of mask inspection, comprising the steps of: obtaining a first image representative of at least part of a mask; applying a printing threshold on the first image to obtain a second image; estimating a contour for each structural element of interest (SEI) of a group of SEIs, and extracting a set of attributes characterizing the contour, giving rise to a group of contours corresponding to the group of SEIs and respective sets of attributes associated with SEIs; for each given contour, identifying, among the remaining contours in the group of contours, one or more reference contours similar to the given contour, by comparing between the respective sets of attributes associated with the contour; and measuring a deviation between the given contour and each reference contour thereof, giving rise to one or more measured deviations indicative of whether a defect is present.SELECTED DRAWING: Figure 2

Inventors:
ARIEL SHKALIM
EVGENY BAL
Application Number:
JP2022129475A
Publication Date:
March 24, 2023
Filing Date:
August 16, 2022
Export Citation:
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Assignee:
APPLIED MATERIALS ISRAEL LTD
International Classes:
H01L21/66; G01N21/956
Attorney, Agent or Firm:
Shinichiro Tanaka
Yoshi Kazuhiko Ta
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Yoshiaki Kudo