Title:
半導体装置製造用マスクシート及びそれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5824402
Kind Code:
B2
Abstract:
AS A MASK SHEET, A MASK SHEET IS DESIRED IN WHICH TAPING WITH RESPECT TO A L/F CAN BE PERFORMED AT A LOWER TEMPERATURE THAN A THERMOPLASTIC MASK SHEET, THERMAL DEGRADATION, WHICH MAY CAUSE AN ADHESIVE REMAINS DURING PEELING OFF THE MASK SHEET, IS DIFFICULT TO GENERATED EVEN WHEN EXPOSED TO A HIGH TEMPERATURE, A WARP IS REDUCED WITH THE FLATNESS, A W/B PROPERTY IS EXCELLENT WITH THE HARDNESS AT A HIGH TEMPERATURE BEING HARDER THAN THAT OF AN ADHESIVE MASK SHEET OF THE RELATED ART, LESS MOLDED RESIN LEAKAGE OCCURS DURING SEALING THAN THAT OF THE ADHESIVE MASK SHEET, AND AN EASILY-PEELING-OFF PROPERTY IS OBTAINED AFTER A PLASMA CLEANING PROCESS, AND A SMALL AMOUNT OF ADHESIVE REMAINS. THE PRESENT INVENTION PROVIDES A MASK SHEET FOR MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A THERMOSET ADHESIVE LAYER WHICH IS LAMINATED ON ONE SURFACE OF A BASE LAYER, AND IS PEELABLY ADHERED TO A METAL PLATE, IN WHICH THE THERMOSET ADHESIVE LAYER CONTAINS A POLYIMIDE RESIN CONTAINING A SILOXANE SKELETON WITH A GLASS TRANSITION TEMPERATURE OF 45°C TO 170°C, AN EPOXY RESIN, A CURING AGENT, AND A FLUORINE ADDITIVE.
Inventors:
Atsushi Yamai
Takayuki Horiya
Takahiro Mori
Takakatsu Ichikawa
Hiromi Yamada
Satoru Machii
Takayuki Horiya
Takahiro Mori
Takakatsu Ichikawa
Hiromi Yamada
Satoru Machii
Application Number:
JP2012084096A
Publication Date:
November 25, 2015
Filing Date:
April 02, 2012
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
H01L23/50; C09J7/02; C09J127/12; C09J163/00; C09J179/08
Domestic Patent References:
| JP2005142401A | ||||
| JP8027430A | ||||
| JP2007123710A |