Title:
半導体装置組立用マスクシートおよび半導体装置の組み立て方法
Document Type and Number:
Japanese Patent JP4002736
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a masking sheet capable of stably producing a semiconductor package such as QFN(quad flat non-load) through suppressing the overhang of resin sealing agent and adhesive transfer in assembling a semiconductor device. SOLUTION: This masking sheet for assembling a semiconductor device is such as to be releasably adhesive to a lead frame. This masking sheet is obtained by providing an adhesive layer of silicone-based adhesive on a heat- resistant film <=150 deg.C in glass transition temperature and 10-50 ppm/ deg.C in linear expansion coefficient at 150-200 deg.C, being characterized by being <=5 wt.% in weight loss percent when heated at 180 deg.C for one hour; wherein it is preferable that the silicone-based adhesive is a polydimethylsiloxane-based one or consists mainly of a polyalkyl alkenylsiloxane and a polyalkylhydrogensiloxane. The other objective method for assembling a semiconductor device comprises the steps of first subjecting the mashing sheet to pressure contact on a lead frame and releasing it after the semiconductor device is assembled.
Inventors:
Katsuji Nakaba
Moriya Yuichi
Toshihiro Nakajima
Moriya Yuichi
Toshihiro Nakajima
Application Number:
JP2001081098A
Publication Date:
November 07, 2007
Filing Date:
March 21, 2001
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
C09J7/02; C09J183/04; H01L23/12; C09J183/05; C09J183/07; H01L21/56; H01L23/50
Domestic Patent References:
| JP2001024001A | ||||
| JP2002164387A |
Foreign References:
| WO1995026047A1 | ||||
| WO2002075809A1 |