To eliminate adverse effects on the positional precision of a pattern caused by radiant heat as much as possible with respect to a mask for vapor deposition, and to allow it to cope with high precision patterning.

In the mask 1 for vapor deposition provided with a thin sheet-shaped mask body 2 in which an opening 4 with a shape corresponding to a vapor deposition pattern is formed, and a frame body 3 which is formed so as to have a hot wire expansion coefficient equal to that of the object to be vapor-deposited, and to which the mask body 2 is fixed in a state where tension is applied to the mask body 2, the tension to be applied to the mask body 2 is set so that the amount of strain caused on the mask body 2 by heat stress by radiant heat on vapor deposition is canceled by the amount of strain caused on the mask body 2 by the tension.