MATCHED DIE MOLDING METHOD AND APPARATUS

Japanese Patent JP3641973

B2

PROBLEM TO BE SOLVED: To prevent the lowering of attaching accuracy or appearance caused by the generation of unevenness on the rear surface of a recessed bent part in a matched die molding method for molding a plate-shaped product from a molten resin sheet.
SOLUTION: A matched die molding apparatus is equipped with a lower mold 10 having a first molding surface which has a recessed part 11a formed on the upper side thereof and an upper mold 20 provided so as to be able to approach and separate with respect to the lower mold 10 and having a second molding surface 21 which holds an almost constant gap with respect to the first molding surface 11 at the most approach position formed on the rear side thereof. A molten resin sheet 30m thinner than the gap is supplied so as to cover the first molding surface 11 to be brought into close contact with the almost all surface of the first molding surface 11 and both molds are set to the most approach position to bring the molten resin sheet becoming the vicinity of the bottom part of a recessed part into close contact with the second molding surface 21 and, subsequently, the molten resin sheet 30m becoming a part other than the vicinity of the bottom part of the recessed part is brought into close contact with the second molding surface 21. The close contact operations of the molten resin sheet under suction are performed by the first and second passages 15A, 15B and upper passage 25 formed in the lower and upper molds.

Koichi Oshiya

JP11794199A

April 27, 2005

April 26, 1999

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Toyota Boshoku Co., Ltd.

B29C51/08; B29C51/10; (IPC1-7): B29C51/10; B29C51/08

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Teruichi Hase
Sakio Oba
Mikio Takagi

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