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Patent Searching and Data


Title:
MATCHING DEVICE
Document Type and Number:
Japanese Patent JPS58221512
Kind Code:
A
Abstract:

PURPOSE: To miniaturize a matching device, by forming an electrode on a single main surface of a dielectric substrate with a resistance thin film and a metallic film and at the same time a metallic film on the other main surface.

CONSTITUTION: An upper electrode 3 made of a resistance film 2 and a metallic film provided across the film 2 is formed on a single main surface of a dielectric substrate 1. While a lower electrode 4 is formed nearly on the entire area of the other main surface of the substrate 1 with a metallic film and by sputtering, vacuum vapor depositing, plating and photoetching processes. In such a way, a capacitor C is obtained between the electrodes 3 and 4. And a matching device is produced with the capacitor C and a resistance R. The value of the resistance R is decided by a degree of separation between unit amplifiers, and the value of the capacitor C is selected so as to obtain the optimum matching of the unit amplifiers.


Inventors:
Sekiyama, Hisatoshi
Akasaka, Seizo
Application Number:
JP1982000104474
Publication Date:
December 23, 1983
Filing Date:
June 17, 1982
Export Citation:
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Assignee:
NEC CORP
International Classes:
H03H7/38; H03F3/60; H03H1/00; H03H7/48; H03H11/28; (IPC1-7): H03H7/38
Domestic Patent References:
JPS5377158A1978-07-08
JPS5442436U1979-03-22
JPS53151343U1978-11-29