PURPOSE: To miniaturize a matching device, by forming an electrode on a single main surface of a dielectric substrate with a resistance thin film and a metallic film and at the same time a metallic film on the other main surface.

CONSTITUTION: An upper electrode 3 made of a resistance film 2 and a metallic film provided across the film 2 is formed on a single main surface of a dielectric substrate 1. While a lower electrode 4 is formed nearly on the entire area of the other main surface of the substrate 1 with a metallic film and by sputtering, vacuum vapor depositing, plating and photoetching processes. In such a way, a capacitor C is obtained between the electrodes 3 and 4. And a matching device is produced with the capacitor C and a resistance R. The value of the resistance R is decided by a degree of separation between unit amplifiers, and the value of the capacitor C is selected so as to obtain the optimum matching of the unit amplifiers.