材料密着度評価方法 - KABUSHIKI KAISHA KOBE SEIKO SHO

Title:

材料密着度評価方法

Document Type and Number:

Japanese Patent JP7084579

Kind Code:

B2

Abstract:

To provide a material adhesion evaluation method capable of appropriately evaluating adhesion of an interface.SOLUTION: A material adhesion evaluation method comprises: an injection step of injecting a liquid material containing polygonal particles on the surface of a material to be evaluated having at least an interface between a first member and a second member; and a measurement step of measuring a peeling start thickness, which is the remaining thickness of the first member when peeling at the interface is started, as adhesion representing the degree of adhesion at the interface.SELECTED DRAWING: Figure 2

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Inventors:

Yuei Nii
Kenji Yamamoto
Yoshio Iwai
Shinya Takada

Application Number:

JP2018201812A

Publication Date:

June 15, 2022

Filing Date:

October 26, 2018

Export Citation:

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Assignee:

KABUSHIKI KAISHA KOBE SEIKO SHO
National University Corporation Fukui University

International Classes:

G01N3/56; G01N19/04

Domestic Patent References:

JP2001183279A
JP2016132814A
JP2006184188A
JP2016068188A
JP2006080267A
JP2017096820A
JP2000171371A
JP2015014503A

Foreign References:

US20050196956

Attorney, Agent or Firm:

Etsushi Kotani
Masataka Kotani
Satoshi Sakurai

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