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Patent Searching and Data


Title:
MATERIAL FOR ADHESION
Document Type and Number:
Japanese Patent JPH0347901
Kind Code:
A
Abstract:

PURPOSE: To manufacture suitable material for adhesion even at the time of joining between different materials by preparing a material containing multiple powder material composed of the specific ratio of Cu, Ti, Mo, Ag, etc., and mechanically engaging and adhering each component with mechanical alloy method.

CONSTITUTION: The material for adhesion composed of wt. ratio of 20 - 50% Cu and 0.5 - 10% at least one kind among Ti, Nb and Zr and further 15 - 50% Mo and the balance Ag with inevitable impurities, is prepared. Then, by mixing stirring and pulverizing the metal powder of each component with grinding machine, etc., the multiple powder (≤ about 5μ particle size) of mechanical alloy shape mechanically engaging and adhering each composition is made to possess about 80% to the whole body. By this method, the material for adhesion having high heat resistance, high adhesive strength and particularly excellent adhesive force to cold-hot heat cycle, is obtd.


Inventors:
SHOJI TAKASHI
KAWACHI TSUNEO
HAGIWARA MASARU
Application Number:
JP18169189A
Publication Date:
February 28, 1991
Filing Date:
July 14, 1989
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
B22F1/00; B22F7/08; C04B37/00; C22C5/06; C22C5/08; C23C24/00; B23K20/00; (IPC1-7): B22F1/00; B22F7/08; B23K20/00; C04B37/00; C22C5/06; C22C5/08; C23C24/00
Attorney, Agent or Firm:
Yaguchi flat