Title:
MATERIAL FOR CERAMIC WIRING SUBSTRATE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPS63254032
Kind Code:
A
Abstract:
A blank material for use as a ceramic wiring substrate of this invention is prepared by laminating a copper foil onto a ceramic base formed from a boron nitride sintered body or the like via a bonding layer interposed therebetween, and incoporating an inorganic filler in at least the ceramic base-containing side of the bonding layer. A fine and high density circuit substrate can be easily formed from the ceramic wiring substrate blank material according to the present invention by a conventional etching method.
Inventors:
ISHIKAWA EIZO
Application Number:
JP8849087A
Publication Date:
October 20, 1988
Filing Date:
April 10, 1987
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO
International Classes:
B32B15/04; B32B18/00; H05K3/38; H05K1/03; (IPC1-7): B32B18/00
Domestic Patent References:
| JPS5745054A | 1982-03-13 | |||
| JPS61104060A | 1986-05-22 |
Attorney, Agent or Firm:
Kazuo Sato
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