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Patent Searching and Data


Title:
MATERIAL COLLECTION METHOD AND MATERIAL COLLECTION APPARATUS
Document Type and Number:
Japanese Patent JP2014024117
Kind Code:
A
Abstract:

To prevent by-products produced as a result of machining from adhering to a workpiece or system optics and thereby from degrading quality of the workpiece and performance of the machine.

An apparatus for collecting material from a workpiece 106 being machined includes a fluid nozzle 200 for inducing a flow of a fluid, and a collection nozzle 202. The collection nozzle 202 includes a motive nozzle for accelerating a first portion of the fluid flow, and an induced-suction nozzle for receiving a second portion of the fluid flow. A suction force can be generated in the vicinity of the induced-suction nozzle one the basis of the accelerated first portion of the fluid flow. The suction force can be sufficient to carry at least a portion of the material away from the workpiece 106.


Inventors:
JEREMY WILLEY
STEVEN SUPALLA
Application Number:
JP2012179666A
Publication Date:
February 06, 2014
Filing Date:
August 14, 2012
Export Citation:
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Assignee:
ELECTRO SCIENT IND INC
International Classes:
B23K26/16; B08B5/00; B23Q11/00
Domestic Patent References:
JPH0284288A1990-03-26
JP2008501531A2008-01-24
JP3143457U2008-07-24
JPH09141482A1997-06-03
JP2000317670A2000-11-21
JPH11254176A1999-09-21
Foreign References:
US20030197909A12003-10-23
Attorney, Agent or Firm:
Tomohiro Mori