Title:
MATERIAL CUTTING DEVICE
Document Type and Number:
Japanese Patent JP3140509
Kind Code:
B2
Abstract:
PURPOSE: To provide a material cutting device capable of automatically carrying out marking on a material for material control, sensing the material and others from this marking and automatically setting a cutting condition.
CONSTITUTION: To automatically apply a coating material (discrimination mark) to show various information of a material and others to a cut member M along the material delivery direction by a coating roller (mark adhesion means) 35 at the time of material delivery, it is possible for a worker to certainly and easily carry out material control and others of a processed article after cutting processing without marking. Additionally, it is possible to automatize the cutting processing as a color discrimination sensor (mark detection means) 15 automatically detects color of the coating materialadhered at the time of material delivery and sends a signal and a control part 13 automatically decides a cutting condition and controls a cutting processing part (cutting machine) 3.
More Like This:
Inventors:
Satoshi Mima
Application Number:
JP25884791A
Publication Date:
March 05, 2001
Filing Date:
October 07, 1991
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
B23D55/00; B23Q17/00; (IPC1-7): B23D55/00; B23Q17/00
Domestic Patent References:
| JP46118A | ||||
| JP343124A | ||||
| JP63216618A | ||||
| JP6244398A | ||||
| JP6211531U |
Attorney, Agent or Firm:
Hidekazu Miyoshi (4 outside)