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Title:
レーザービームを用いた材料の穿孔および除去装置
Document Type and Number:
Japanese Patent JP4873191
Kind Code:
B2
Abstract:
A device for boring and material removal by laser beam comprises an image rotator (2) and focusing device (4) with an equalizing unit (3) between them that turns with the same direction and frequency as the image rotator and comprises a parallel displacing (15) and angle adjusting (13,14) unit. The equalizing unit is adjustable in its turning position relative to the image rotator.

Inventors:
Wawels, Verf
Gilner, Arnold
Application Number:
JP2008518647A
Publication Date:
February 08, 2012
Filing Date:
March 03, 2006
Export Citation:
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Assignee:
Fraunhofer Gesellschaft Tool Feldrunk del Angevantten Forsunc A Fau
International Classes:
B23K26/38; B23K26/06; B23K26/08; B23K26/36; G02B13/00
Domestic Patent References:
JP2001516648A2001-10-02
JPH0938790A1997-02-10
JPS5992187A1984-05-28
JP2002137080A2002-05-14
JP2003311455A2003-11-05
JPH1147963A1999-02-23
JP2002113587A2002-04-16
JPH06320296A1994-11-22
JP2002001561A2002-01-08
Foreign References:
US6362454B12002-03-26
CA2260462A12000-07-26
Attorney, Agent or Firm:
Takayoshi Kusumoto
Takanobu Nakaetsu