Title:
MATERIAL HANDLING DEVICE FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2755343
Kind Code:
B2
Abstract:
PURPOSE: To obtain material handling device for manufacturing electronic components which can surely set a lead frame after directing the frame towards a prescribed groove irrespective of the shape of a head section.
CONSTITUTION: Clamper bars 2 are closed (m6 and m7) to a clearance 2d smaller than the width 4d of a head section 4 and larger than the thickness 3d of a lead frame 3 so that the bars 2 can hold the lead frame 3 between them while a clamper 1 clamps the head section 4. When the head section 4 is released from the clamper 1, the frame 3 drops down and the lower surface of the section 4 is caught by the bars 2. Then the frame 3 is put in a groove 5a by raising a loading bar 5 (m3) and the bars 2 are opened (m8 and m9). Finally, the loading bar 5 is lowered (m4) and the frame 3 is put in the groove 7a of a frame guide 7.
Inventors:
IKEDA TATSUO
SATO TAKATOSHI
SATO TAKATOSHI
Application Number:
JP8847393A
Publication Date:
May 20, 1998
Filing Date:
April 15, 1993
Export Citation:
Assignee:
ROOMU KK
International Classes:
B65G47/88; B65G47/90; H05K13/04; (IPC1-7): H05K13/04; B65G47/90
Attorney, Agent or Firm:
Shizuo Sano
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