Title:
MATERIAL FOR INSULATING SUBSTRATE, PRINTED WIRING BOARD, LAMINATE, COPPER FOIL WITH RESIN, COPPER-CLAD LAMINATE, POLYIMIDE FILM, FILM FOR TAB, AND PREPREG
Document Type and Number:
Japanese Patent JP3863771
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a material for an insulating substrate which is excellent in mechanical properties, dimensional stability, heat resistance, flame retardancy, etc., and can exhibit an excellent flame-retardant effect due to the shape retention effect on burning; and a printed wiring board, a copper foil with a resin, a copper-clad laminate, a polyimide film, a film for TAB, and a prepreg prepared by using the material for an insulating substrate.
SOLUTION: This material for an insulating substrate contains 100 pts.wt. resin component comprising a thermoplastic resin or a mixture of a thermoplastic resin with a thermosetting resin and 0.1-100 pts.wt. layered silicate.
Inventors:
Mitsuharu Yonezawa
Koichi Shibayama
Katsuo Fushimi
Hideyuki Takahashi
Koji Taniguchi
Yagi Motohiro
Koichi Shibayama
Katsuo Fushimi
Hideyuki Takahashi
Koji Taniguchi
Yagi Motohiro
Application Number:
JP2001375337A
Publication Date:
December 27, 2006
Filing Date:
December 10, 2001
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C08J5/18; C08L101/00; C08J5/24; C08K3/34; C08K5/00; C08K7/00; C08K9/04; C08L63/00; H01B17/56; H01B17/62; H05K1/03; (IPC1-7): C08L101/00; C08J5/18; C08J5/24; C08K3/34; C08K5/00; C08L63/00; H01B17/56; H01B17/62; H05K1/03; //C08L79:08
Domestic Patent References:
| JP10279705A | ||||
| JP2000160011A | ||||
| JP2000313801A | ||||
| JP2000327805A | ||||
| JP11228817A | ||||
| JP11315204A | ||||
| JP2000336276A | ||||
| JP2000086822A | ||||
| JP11181190A |
Attorney, Agent or Firm:
Miyazaki saki main tax
Table of contents Makoto
Yasuo Yasutomi
Table of contents Makoto
Yasuo Yasutomi
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