層間絶縁膜用材料、感光性樹脂組成物、積層体、回路基板およびその製造方法

Title:

層間絶縁膜用材料、感光性樹脂組成物、積層体、回路基板およびその製造方法

Document Type and Number:

Japanese Patent JP6404814

Kind Code:

B2

Abstract:

The purpose of the present invention is to provide a block polyamide acid imide having an appropriate solubility in aqueous alkaline solutions, and block polyimides that are obtained using same and have high transparency and a low coefficient of linear thermal expansion (low CTE). This block polyimide comprises blocks configured from repeating structural units represented by formula (1A) and blocks configured from repeating structural units represented by formula (1B).

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Inventors:

Kenichi Fukukawa
Maki Okazaki
Yoshihiro Sakata
Tatsunobu Urakami
Atsushi Okubo

Application Number:

JP2015513568A

Publication Date:

October 17, 2018

Filing Date:

April 23, 2014

Export Citation:

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Assignee:

Mitsui Chemicals, Inc.

International Classes:

C08G73/10; B32B15/088; C08J5/18; G03F7/037; H01B3/30; H01L21/027; H05K3/46

Domestic Patent References:

JP2012255985A
JP2013052604A

Foreign References:

WO2010113412A1

Attorney, Agent or Firm:

Koichi Washida

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