Title:
材料のプレースメント成形方法および装置
Document Type and Number:
Japanese Patent JP5458248
Kind Code:
B2
Abstract:
A material placement head for dispensing and compacting a plurality of strips of a material onto a surface with a plurality of independently movable roller assemblies. Each roller assembly of the placement head comprises a compacting roller and may be rotatably and linearly moved in six-degrees of freedom independent of the other roller assemblies of the placement head. The roller assemblies may be arranged in a staggered configuration and substantially simultaneously apply the plurality of strips of the material to the surface, such that the strips of the material are applied to adjacent paths on the surface. Each compacting roller may be malleable and substantially crowned around its outer circumferential surface to provide even compaction to the strips of the material.
Inventors:
Wampler Robert Ray
Ulam Hamad Zia
Ulam Hamad Zia
Application Number:
JP2010536038A
Publication Date:
April 02, 2014
Filing Date:
October 30, 2008
Export Citation:
Assignee:
Spirit Aero Systems, INC.
International Classes:
B29C31/08; B29C70/06
Domestic Patent References:
| JP2004175116A | ||||
| JP2001521839A | ||||
| JP2007503329A | ||||
| JP62037161A |
Foreign References:
| US20050039843 | ||||
| US4750965 | ||||
| US6544367 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Haruko Sanwa
Previous Patent: JPS5458247
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