PURPOSE: To obtain a material plated with Al by vapor deposition and excellent in adhesion, workability, corrosion resistance, microwave characteristics, etc., by regulating the amts. of Si, Fe, Cu, Ni, O and other inevitable impurity elements contained in a plating film.
CONSTITUTION: When Al as a plating material is evaporated by heating in vacuum and an Al plating film is formed on the surface of a steel sheet, the amts. of impurity elements contained in the Al plating film formed by vapor deposition are regulated to, by weight, ≤0.15% Si, ≤0.15% Fe, ≤0.005% Cu, ≤0.0001% Ni, ≤0.01% O and ≤0.30%, in total, of the five elements and inevitable impurity elements other than Ti, Cr and Mn. The objective material plated with Al by vapor deposition and excellent in adhesion, etc., can be obtd. The plating by vapor deposition is preferably carried out by electron beam heating with high energy density.
KAWAFUKU JIYUNJI
IRIE KOJI
AYABE HARUHIRO
KATO ATSUSHI
MIYAKE SHOJI
