Title:
MATERIAL RESISTANT TO ACID ETCHING, METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT USING THE SAME, AND COPOLYMER
Document Type and Number:
Japanese Patent JP2005290218
Kind Code:
A
Abstract:
To provide a material resistant to acid etching, particularly a material resistant to acid etching using concentrated hydrofluoric acid, for use in the frosting process for improving on the light extracting efficiency of a light emitting element, sufficiently resistant to acid and, concurrently, high in alkali-solubility.
The material resistant to acid etching has the repeating unit represented by formula (1). In formula (1), R1 is a hydrogen atom or a methyl group, R3 is a cyclic group selected from the group consisting of aliphatic cyclic groups and aromatic groups, and R4 is a polar group. R2 is represented by formula (2), and n is 0 or 1. In formula (2), R5 is a hydrogen atom or a methyl group.
Inventors:
ASAKAWA KOUJI
OHASHI KENICHI
FUJIMOTO AKIRA
OHASHI KENICHI
FUJIMOTO AKIRA
Application Number:
JP2004108108A
Publication Date:
October 20, 2005
Filing Date:
March 31, 2004
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
C08K5/28; C08F20/26; C08L33/14; (IPC1-7): C08F20/26; C08K5/28; C08L33/14
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto
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