Title:
MATERIAL SUPPLY DEVICE OF TWO INJECTION DEVICES
Document Type and Number:
Japanese Patent JP2005288855
Kind Code:
A
Abstract:
To injection-mold a molded product by using resins same in history by two injection devices by using one hopper device in common.
The material supply device is constituted of the first supply pipe erected on one of two injection devices parallelly provided on a machine stand, the hopper device connected to the upper end of the hopper device first supply pipe to be fixed on the two injection devices, a second supply pipe branched to the other injection device from the hopper device and a detector provided above the branched region of the second supply pipe to detect a material level to automatically supply a molding material to the hopper device.
Inventors:
TAKIZAWA KIYOTO
SHIOZAWA FUMIO
SHIMIZU KEIZO
SHIOZAWA FUMIO
SHIMIZU KEIZO
Application Number:
JP2004106658A
Publication Date:
October 20, 2005
Filing Date:
March 31, 2004
Export Citation:
Assignee:
NISSEI PLASTICS IND CO
International Classes:
B29C45/18; B29C45/13; (IPC1-7): B29C45/18; B29C45/13
Attorney, Agent or Firm:
Teruo Akimoto
Sowa Kato
Sowa Kato