PURPOSE: To prevent deformation or disconnection of a fine circuit by using a main metal-component resinate and an auxiliary metal-component resinate which do not contain lead and bismuth.

CONSTITUTION: A ceramic or glass base material is coated with a main metal- component resinate and an auxiliary metal-component resinate; this assembly is dried and baked to form a thin-film resistor. As its constituent components, respective resinates of boron and silicon as glass components are added in the main metal-component resinate and the auxiliary metal-component resinate, lead and bismuth are not added, a thermoset resin is added as an organic binder and a uniform solution is formed by using an organic solvent. The main metal- component resinate is composed of one or more kinds selected from ruthenium, iridium and rhodium; the auxiliary metal-component resinate is composed of one or more kinds selected from zinc, zirconium, magnesium, lanthanum, aluminum, barium, calcium, strontium, manganese and potassium.