Title:
高周波用電子部品用材料及び当該材料からなる高周波用電子部品
Document Type and Number:
Japanese Patent JP5345753
Kind Code:
B2
Abstract:
A material is provided for high-frequency use electronic parts, in which the material has dielectric properties which make the material suitable for use in a high-frequency region while maintaining various properties of a cycloolefin resin. It further has suitability for plating, high adhesion to metal deposit layers, and superior impact resistance. Also provided is a high-frequency use electronic part which includes the material. The material is a composition including a cycloolefin resin (A) and an elastomer ingredient (B) in which the blending proportion of the cycloolefin resin (A) to the elastomer ingredient (B) and the proportion of unsaturated double bonds contained in the elastomer ingredient (B) are in specific ranges.
Inventors:
Kunimoto Rise
Hirotaka Miyazaki
Hirotaka Miyazaki
Application Number:
JP2006129825A
Publication Date:
November 20, 2013
Filing Date:
May 09, 2006
Export Citation:
Assignee:
Polyplastics Co., Ltd.
International Classes:
C08L45/00; B32B15/08; C08L53/02; C08L65/00
Domestic Patent References:
| JP1256548A | ||||
| JP6001895A | ||||
| JP2003115645A | ||||
| JP2001011248A | ||||
| JP2001011247A | ||||
| JP2006352470A | ||||
| JP2004167687A | ||||
| JP2000273265A | ||||
| JP8325440A | ||||
| JP11162551A | ||||
| JP11060971A | ||||
| JP2004169049A |
Foreign References:
| WO2006095511A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Previous Patent: JPS5345752
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