Materials polyimide resin for adhesives layer formation of a cover lei film - Nippon Steel & Sumikin Chemical Co., Ltd.

Title:

Materials polyimide resin for adhesives layer formation of a cover lei film

Document Type and Number:

Japanese Patent JP6082439

Kind Code:

B2

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Inventors:

Tetsuya Nakanishi
Ryo Mori
Yoshiki Sudo

Application Number:

JP2015136818A

Publication Date:

February 15, 2017

Filing Date:

July 08, 2015

Export Citation:

Assignee:

Nippon Steel & Sumikin Chemical Co., Ltd.

International Classes:

C08G73/10; C09J7/02; C09J179/08

Domestic Patent References:

Foreign References:

US3803103

Attorney, Agent or Firm:

Kazuhiro Watanabe
Katsumi Hoshimiya
Tatsuya Josawa

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