熱交換のための手段、方法及びシステム

Title:

熱交換のための手段、方法及びシステム

Document Type and Number:

Japanese Patent JP2013524153

Kind Code:

A

Abstract:

A heat transfer device and its manufacturing method are provided. The heat transfer device has a heat transfer member defining a heat exchange surface with which a heat transportable medium contact in use and via which heat is transferable between the heat transportable medium and a working medium, and a device body for containing the heat transportable medium. The body of the device defines a first chamber, a second chamber and a third chamber which are in fluid communicable relationship. The body is configured to allow the heat transportable medium fluid to pass from the second chamber to the first chamber and then to the third chamber, or from the third chamber to the first chamber and then to the second chamber, and the second chamber is sandwiched or positioned between the first chamber and the third chamber in the body.

Inventors:

Peters, Stephan
Tse Kajeong

Application Number:

JP2013502988A

Publication Date:

June 17, 2013

Filing Date:

February 24, 2011

Export Citation:

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