Title:
MEASURING DEVICE FOR COORDINATE OF OUTER CIRCUMFERENCE OF WAFER
Document Type and Number:
Japanese Patent JPS59125627
Kind Code:
A
Abstract:
PURPOSE:To measure the coordinates of the outer circumference of the wafer casily with high accuracy by a simple mechanism, which is not in contact with the wafer, by providing an angle detector detecting an angle of rotation of the wafer and a sensor measuring the change of the amount of light of a light source interrupted by the fringe section of the wafer. CONSTITUTION:The wafer 31 is fixed onto a wafer chuck 32, and the angle of rotation of the wafer 31 is detected by the angle detector 34 while turning the wafer 31 at fixed speed by a spindle 30. The amount of light which is not interrupted by the fringe section of the wafer 31 and passes is measured while being synchronized with the detection of the angle of rotation. Distances up to the center of the spindle 30 from the circumferential end of the wafer 31 can be measured extending over the whole circumference of the wafer 31 from the change of the amount of light and said angle of rotation. The central coordinates of the wafer 31 and the direction of an orientation flat surface can be arithmetically operated easily from the coordinate values of the circumferential surface of the wafer 31.
Inventors:
SATOU YASUHARU
Application Number:
JP83483A
Publication Date:
July 20, 1984
Filing Date:
January 07, 1983
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
G03F9/00; G05D3/12; H01L21/027; H01L21/30; H01L21/68; (IPC1-7): G03F9/00; G05D3/00; H01L21/68
Attorney, Agent or Firm:
Takehiko Suzue