Title:
MEASURING METHOD, MEASURING DEVICE, AND QUALITY CONTROL METHOD
Document Type and Number:
Japanese Patent JP3712722
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method which a semiconductor device manufacturing process is controlled based on an obtained dimension, and which includes a work piece dimension measuring process in which the transverse direction dimension of a pattern formed on a wafer is measured rapidly, without contact and nondestructively, using an ellipsometry.
SOLUTION: On a calibration pattern, having a confirmed dimension formed on the wafer, a polarizing state parameter, is obtained and a database is formed. Based on the polarization parameters of a measuring sample, the database is searched, then dimensions are obtained.
Inventors:
Hiroshi Arimoto
Application Number:
JP2004159592A
Publication Date:
November 02, 2005
Filing Date:
May 28, 2004
Export Citation:
Assignee:
富士通株式会社
International Classes:
G01B11/02; G01B11/24; G01B11/26; H01L21/66; (IPC1-7): G01B11/02; G01B11/24; G01B11/26; H01L21/66
Domestic Patent References:
| JP9036037A |
Attorney, Agent or Firm:
Tadahiko Ito