Title:
MEASURING METHOD AND MEASURING JIG OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3042408
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enable the electric test of a BGA (semiconductor device) which lost solder balls, and improve reliability and performance of a BGA.
SOLUTION: A measuring jig 20 is used when, after a semiconductor device wherein solder balls for mounting onto a device board are installed is mounted on the device board, the semiconductor device is again peeled from the device board, and a BGA 4 which lost the solder balls in installed on an IC socket 7 for electric test. A plurality of balls 2 enabling electric conduction between each electrode of a plurality of socket electrodes 11 installed in an IC socket 7 and the parts where the solder balls of the semiconductor device have been installed are installed.
Inventors:
Hiroshi Koizumi
Application Number:
JP17775396A
Publication Date:
May 15, 2000
Filing Date:
July 08, 1996
Export Citation:
Assignee:
NEC
International Classes:
G01R1/04; H01R11/01; G01R31/26; H01R33/76; H01R33/97; H01R43/00; (IPC1-7): G01R31/26
Domestic Patent References:
| JP822875A | ||||
| JP7211416A |
Attorney, Agent or Firm:
Noriaki Miyakoshi