To provide a measuring wiring substrate having high measurement accuracy, and superior reliability, a probe card, and an evaluation device therefor.

The measuring wiring substrate includes an insulating substrate 1, a wiring layer 2 arranged on the surface and/or the inside of the substrate 1, and measurement terminals 3, provided on the surface of the substrate 1 for measuring a plurality of semiconductor element 102a formed on a semiconductor wafer 102. The average heat puffing coefficient in the wiring substrate at -40 to +400°C is 2×10-6/°C to 5×10-6/°C, and the difference in elongation between the wiring substrate and the semiconductor wafer 102 is within 0.02% over the whole temperature range -40 to +400°C.