Title:
力学量測定装置
Document Type and Number:
Japanese Patent JP5779662
Kind Code:
B2
Abstract:
A mechanical quantity measuring device (semiconductor strain sensor) has a semiconductor chip including a plurality of piezoresistive elements formed on a front surface of a semiconductor substrate, a lead wire unit electrically connected to a plurality of electrodes of the semiconductor chip, and a plate member joined to a rear surface of the semiconductor chip. Further, the plate member includes a first region facing the rear surface of the semiconductor chip and a second region provided adjacent to the first region, and a thickness of the plate member in the first region is made larger than a thickness in the second region.
Inventors:
Yoshiaki Ashida
Hiroyuki Ota
Hiroyuki Ota
Application Number:
JP2013547986A
Publication Date:
September 16, 2015
Filing Date:
December 06, 2011
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G01B7/16; G01L1/18
Domestic Patent References:
| JP9264800A | ||||
| JP2009229183A | ||||
| JP557856U | ||||
| JP2011191103A |
Foreign References:
| WO2009028283A1 | ||||
| US20070111355 |
Attorney, Agent or Firm:
Yamato Tsutsui