PURPOSE: To make a resist and an amount of a developing solution uniform inside a face of a wafer and to reduce an irregularity in a patterned size inside the face by using a ring for dummy use which accepts the wafer and forms a coated face on an extended face at its periphery.

CONSTITUTION: A wafer chuck 4 which sucks and holds a wafer and turns the wafer is equipped with a ring 3 for dummy use which accepts the wafer 1 and where an opening is made; the ring 3 for dummy use is a ring-shaped body which has the opening whose diameter is a little larger than an outer diameter of the wafer 1; the rise height of a ring-shaped rise part 3a is set to be identical to the thickness of the wafer 1 which has been accepted inside the opening and is held on the chuck 4; the surface of the rise part 3a forms a face extended from the surface of the wafer 1. When a resist 2 is dropped onto the wafer 1 and the wafer is turned, the resist 2 is spread toward a peripheral part. During this process, the resist 2 is spread up to the surface of the rise part 3a of the ring 3 for dummy use. When a coating operation is finished, a thick part of a resist film is situated on the ring 3 for dummy use; the film thickness on the wafer becomes uniform.